In a groundbreaking partnership, Lightmatter, a leader in photonic supercomputing, has teamed up with Amkor Technology, a leading provider of semiconductor packaging and test services, to create the world's largest 3D-packaged chip complex. This collaboration brings together Lightmatter's innovative Passage platform, which uses 3D-stacked photonic engines, and Amkor's advanced multi-die packaging expertise to meet the unprecedented interconnect scaling and power demands of today's Artificial Intelligence (AI) workloads.
The partnership aims to overcome the limitations of traditional chip design by integrating more silicon in a single package. Lightmatter's Passage platform enables optical I/O anywhere across the chip area, providing significantly higher connection density and bandwidth both within and outside the package. Ritesh Jain, SVP of Engineering and Operations at Lightmatter, hailed the partnership as a "pivotal step" in building a world-class ecosystem for AI and high-performance computing offerings. Kevin Engel, EVP, Business Units at Amkor, expressed excitement about collaborating with Lightmatter to bring this groundbreaking silicon photonics technology to mainstream market availability.
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